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Euroasian Journal of Semiconductors Science and Engineering

Euroasian Journal of Semiconductors Science and Engineering

Abstract

The paper presents the results of the development of a method and means of measuring the contact potential difference based on the analysis of the compensation dependence of the Kelvin probe (non-compensation technique). The method is implemented in a digital Kelvin probe and used for non-destructive contactless testing of semiconductor wafers based on characteristics of spatial distribution of electron work function.

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